Wirebonding

Contact Person: Mikko Laasanen

Desrcription of Expertise:

Wirebonder is used for making interconnections between a microsensor and measurement electronics. We are using mainly ball bonding with gold wire (25 micron, 120 C degree sample stage heating).

We have developed highly reproducible routines for the ball bonding. The bonds can be tested with a non destructive type tester.

Electrical operation of the bondable stuructures can be tested prior to bonding by using a micromanipulator based probe station.