RF Sputtering System, Edwards + Leybold

Name and Model: RF Sputtering System, Edwards + Leybold

Contact Person: Sergey Novikov
sergey.novikov(at)tkk.fi

Year of Manufacture: 1995

Year of Installation: 2007

General Technical Information:

Substrate Size:

100 mm dia. Max. Sample rotation. Holders for smaller samples are available.

Allowed Materials:

Metal, oxides (currently Al, Nb, Sn, Si, SiO2, ITO targets are available)

Forbidden Materials:

Elements with the high vapor pressure at the room temperature (Pb,Zn,Cd V-VI group), organic.

Availability and Cost:

Availability Class: F (Use allowed for all researchers with permission.)
Price Category: Low

Desrcription of Use: RF sputtering and thermal evaporation.

Key Features and Accessories: 1” magnetron + 1 place for thermal evaporation. Oxygen gas system for reactive sputtering.

Key Specifications: • Deposition rate for metals up to 2nm/s, for oxides up to 0.5nm/s
• Maximum RF power 200W at 13MHz

Photograph:

Location: Micronova Nanofabrication Centre – Nanofab 1019. Tietotie 3, 02150 Espoo

City: Espoo