UHV (Cryo-torr 8, Telemark TT 10) + Ion Gun (Tectra IonEtch GenII)
Antti Nuottajärvi
nuanka@jyu.fi +358503956002
1998
1998
Ultra High Vacuum e-beam evaporator with Ion Gun attached
Thin film deposition of metals. Ion sputtering.
e-beam deposition of Au, Ag, Cu, Al, Nb, Ta, Ti. Tunnel junction processing by oxidation between depositions.
Ar ion sputtering of metallic structures and sample cleaning/preparation. Current can be measured while sputtering.
TT-271 e-gun with 8 pockets revolver
TT-10 power with acceleration voltage 4-10 kV
Max. current 1 A @ 10 kV
Cryopumped down to 10-9 mbar
Tectra GenV Ion Gun: Ion energy 25 ev - 5 keV, total beam current 1 mA @ 5 kV (Ar)
University of Jyväskylä, Nanoscience Center, Cleanroom
Survontie 9, 40500 Jyväskylä
Jyväskylä