Name and Model: LoadPoint MicroAce 3
Contact Person: Antti Nuottajärvi nuanka@jyu.fi
Year of Manufacture:
Year of Installation:
General Technical Information:
Tool for dicing Silicon and glass substrates
Desrcription of Use:
Pre cutting and cutting Silicon wafers and other substrates
Key Features and Accessories:
Semi-automatic mode. Equipped with twin videoscope.
Key Specifications:
Photograph:
Location: University of Jyväskylä, Nanoscience Center, Cleanroom Survontie 9, 40500 Jyväskylä
City: Jyväskylä
Additional information:
Booking:
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