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1. Nanofabrication
2. Characterization
3. Computation, Modeling and Simulation
4. Other

1. Nanofabrication
1.1. Nanolithography and Direct Patterning

1.1.1. Photolithography

1.1.2. Electron Beam Lithography (EBL)

1.1.3. Nanoimprint Lithography (NIL)

1.1.4. Laser Interference Lithography (LIL)

1.1.5. Near Field Holography (NFH)

1.1.6. Micro Contact Printing

1.1.7. Focused Ion Beam Milling

1.1.8. Ion/Electron Beam Assisted Vapor Deposition

1.1.9. Dip Pen Nanolithography

1.1.10. Other Nanolithography and Direct Patterning

1.2. Thin film Deposition and Growth

1.2.1. Magnetron Sputtering

1.2.2. E-beam Evaporation

1.2.3. Thermal Evaporation

1.2.4. Arc Evaporation

1.2.5. Pulsed Laser Deposition (PLD) - ablation

1.2.6. Ion Beam Deposition, Ion Beam Sputtering (IBD, IBS)

1.2.7. Chemical Vapour Deposition (CVD)

1.2.8. Plasma Enhanced Chemical Vapour Deposition (PECVD)

1.2.9. Other CVD (HWCVD, LACVD)

1.2.10. Atomic Layer Deposition (ALD)

1.2.11. Electrodeposition

1.2.12. Sol-Gel Deposition

1.2.13. Langmuir-Blodgett (LB)

1.2.14. Spin Coating

1.2.15. Layer-by-Layer Assembly

1.2.16. Molecular Beam Epitaxy (MBE)

1.2.17. Vapour Phase Epitaxy (VPE)

1.2.18. Other Thin film Deposition and Growth

1.3. Self-Assembly and Self-organization

1.3.1. Assembly

1.3.2. Self-organized Growth

1.3.3. Self-organized Etching

1.3.4. Other Self-Assembly and Self-organization

1.4. Etching

1.4.1. Reactive Ion Etching (RIE, DRIE)

1.4.2. Plasma Etching

1.4.3. Ion Beam Milling and Electron Beam Assisted Etching

1.4.4. Wet Etching

1.4.5. Laser Ablation

1.4.6. Electrochemical Etching

1.4.7. Other Etching

1.5. Surface Modification

1.5.1. Dry Cleaning

1.5.2. Wet Cleaning

1.5.3. Mechanical Polishing

1.5.4. Chemical Mechanical Polishing

1.5.5. Biosensitive Surface Functionalization

1.5.6. Other Surface Functionalization

1.5.7. Other Surface Modification

1.6. Structural Modification

1.6.1. Ion Implantation

1.6.2. Diffusion

1.6.3. Thermal Annealing

1.6.4. Particle Beam Irradiation

1.6.5. Other Structural Modification

1.7. Nanowire and Tube Synthesis

1.7.1. Metallic Nanowires

1.7.2. Semiconducting Nanowires

1.7.3. Polymeric Nanowires

1.7.4. Ceramic Nanowires

1.7.5. Carbon Nanotubes

1.7.6. Other Nanowire and Tube Synthesis

1.8. Nanoparticle Synthesis

1.8.1. Vapor Phase Synthesis of Inorganic Nanoparticles

1.8.2. Wet Process Synthesis of Inorganic Nanoparticles

1.8.3. Synthesis of CNTs, Fullerenes and Graphene

1.8.4. Semiconducting Nanoparticles and Quantum Dots

1.8.5. Insulating Nanoparticles

1.8.6. Organic Nanoparticles

1.8.7. Other Nanoparticle Synthesis

1.9. Molecular Fabrication and Synthesis

1.9.1. Supramolecule Synthesis

1.9.2. Other Molecular Fabrication and Synthesis

1.10. Biological and Cellular Tools

1.10.1. Fermenting

1.10.2. Cell Culture

1.10.3. Cellular Probes

1.10.4. Cellular Adhesion

1.10.5. Other Biological and Cellular Tools

1.11. Device Fabrication

1.11.1. Nanoelectronic Devices

1.11.2. Nanophotonic Devices

1.11.3. Nanofluidics

1.11.4. Other Device Fabrication

2. Characterization
2.1. Imaging, Surface Profiling and Geometric Characterization

2.1.1. Scanning Electron Microscopy (SEM)

2.1.2. Transmission Electron Microscopy (TEM)

2.1.3. Scanning Tunneling Microscopy (STM)

2.1.4. Atomic Force Microscopy (AFM)

2.1.5. Focused Ion Beam (FIB)

2.1.6. X-ray Tomography

2.1.7. Confocal Microscopy

2.1.8. Surface Profilometry

2.1.9. Particle Size Analysis and Counting (PCS, DLS)

2.1.10. Other Imaging, Surface Profiling and Geometric Characterization

2.2. Nanostructure analysis

2.2.1. X-ray scattering (SAXS, WAXS)

2.2.2. Electron Backscattered Diffraction (EBSD)

2.2.3. Other Nanostructure analysis

2.3. Film thickness measurement

2.3.1. Ellipsometry

2.3.2. Reflectometry

2.3.3. Profilometry

2.3.4. Interferometry

2.3.5. UV-vis Spectroscopy

2.3.6. Other Film thickness measurement

2.4. Elemental analysis

2.4.1. Electron Spectroscopy (XPS/ESCA, AES, SAM)

2.4.2. X-ray Analysis (EDS/EDX, WDX, XRF)

2.4.3. Optical Spectroscopy (LIPS, ICP-OES)

2.4.4. Mass Spectrometry (SIMS, ICP-MS, LA-ICP-MS, TOF)

2.4.5. Rutherford Backscattering Spectrometry (RBS)

2.4.6. Elastic Recoil Detection (ERDA, HFS)

2.4.7. Inelastic Neutron Scattering (INS)

2.4.8. Deep Level Spectroscopy (DLS, DLTS)

2.4.9. Other Elemental analysis

2.5. Chemical Structure Characterization

2.5.1. Optical Spectroscopy (IR, FTIR, Raman)

2.5.2. Secondary Ion Mass Spectrometry (SIMS)

2.5.3. Scanning Near-field Optical Microscopy (SNOM)

2.5.4. Nuclear Magnetic Resonance (NMR)

2.5.5. Electron Spectroscopy (XPS/ESCA, AES, SAM)

2.5.6. X-ray Spectroscopy (XRF, NEXAFS/EXAFS)

2.5.7. Crystal Structure Characterization (XRD, EBSD)

2.5.8. Electron Energy Loss spectroscopy (EELS)

2.5.9. Low Energy Electron Diffraction (LEED)

2.5.10. Electron Paramagnetic Resonance (EPR)

2.5.11. Other Chemical Structure Characterization

2.6. Surface Energy Analysis

2.6.1. Contact Angle measurement

2.6.2. Other Surface Energy Analysis

2.7. Thermal Characterization

2.7.1. Thermogravimetry

2.7.2. Differential Scanning Calorimetry

2.7.3. Dynamic Mechanical and Dielectric Analysis

2.7.4. Other Thermal Characterization

2.8. Electrical and Magnetic Characterization

2.8.1. Capacitance Measurements

2.8.2. Current-Voltage Measurements

2.8.3. Surface Resistance Measurements

2.8.4. ECV Doping Profiling (Polaron)

2.8.5. Hall Measurements

2.8.6. Electroluminescence Spectroscopy (EL)

2.8.7. Magnetometry

2.8.8. Impedance Spectroscopy

2.8.9. Cathodoluminescence

2.8.10. Opto-acoustic Spectroscopy

2.8.11. Ultraviolet Photoelectron Spectroscopy (UPS)

2.8.12. Other Electrical and Magnetic Characterization

2.9. Optical Characterization

2.9.1. Scanning Near-field Optical Microscopy (SNOM)

2.9.2. Spectroscopic Ellipsometry (SE, VASE)

2.9.3. Photoluminescence Spectroscopy (PL)

2.9.4. Spectrophotometry

2.9.5. Other Optical Characterization

2.10. Mechanical Characterization

2.10.1. Nanoindentation

2.10.2. Scratch Testing

2.10.3. Other Mechanical Characterization

2.11. Electrochemical Characterization

2.11.1. Voltammetry

2.11.2. Other Electrochemical Characterization

2.12. Reaction Mechanism Studies

2.12.1. Time Resolved Photoluminescence Spectroscopy (TRPL)

2.12.2. Quartz Crystal Microbalancing (QCM, EQCM)

2.12.3. Quadrupole Mass Spectroscopy (QMS)

2.12.4. Other Reaction Mechanism Studies

2.13. Other Characterization

3. Computation, Modeling and Simulation
3.1. Software

3.1.1. Image Analysis Software

3.1.2. Atomistic Modeling Softaware

3.1.3. Mesoscopic Modeling Softaware

3.1.4. Continuum Modeling Softaware

3.1.5. Other Software

3.2. Databases

3.3. Computational Facilities

4. Other

MIKTECH OY - Graanintie 5, 50190 Mikkeli FINLAND

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